The production management of Cell Phone Jammers will not be discussed in the meeting

 Light propagation route that most students in the comparison after the unification of light painting.
The production management of Cell Phone Jammers will not be discussed in the meeting. Non-contact laser processing method of processing, high efficiency, no pollution, high-precision heat-affected zone is small, so in the electronics industry, especially in the microelectronics industry has been widely used. Integrated circuit, the resistance of the sensor is a layer of resistive film, manufacturing errors up to ± 15-20%, only the correction of high-precision device that can improve the yield. Laser beam can be focused to a small, energy concentration, processing of the adjacent heat affected a very small component, does not produce pollution, but also easy to use computer-controlled, so to meet the fast-trimmed resistor so as to reach an accurate value for the purpose intended. Processing of the laser beam is focused on the resistive film, the material vaporized. When the first fine-tuning resistance measurements, the data transmitted to the computer, computer based methods of pre-designed trimming instructions laser beam positioning allows the path cut by a certain resistance, until the resistance reaches the set value. Can also use the laser sheet correction capacitor capacitance, the principle is the laser beam is focused on the capacitance of the electrode, so that an area of vaporization decreases, until reduced to a predetermined capacitance value. The workshop of Cell Phone Jammers has successfully complete the production task of Cell Phone Jammers .
ESI U.S. is the world's largest manufacturer of laser trimming machine, the major integrated circuit manufacturer has provided thousands of sets of fine-tuning machine. China's electronic eleven have been able to produce high-speed thick film circuit laser trimming machine, 50,000 per hour, adjustable resistance. The information age, a variety of semiconductor memory products based on advanced electronic devices, due to a more integrated, in the manufacturing process will always have some defects, so highly integrated memory circuit yield dramatically. Redundancy correction is dedicated in memory circuit design to add some redundancy as well as the corresponding row and column address decoding circuit, the circuit system is completed, the first circuit on the wafer test, and then use the laser failed memory unit containing rows and columns to interrupt the circuit connection, then redundant row and column decoding circuit corresponding connection is interrupted, disconnect the row and column is assigned the address of the final determination of whether the circuit has been repaired qualified. With increasing storage density, using a special circuit techniques to suppress the data is no longer defective unit into rows and columns, other then laser cut redundant address decoding circuit for connection to complete the repair.